### Overview of ATS-17B-90-C2-R0 The **ATS-17B-90-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.36 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Pressure Flow** | Cross-cut (Multiple Fin Directions) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components & Design Features #### 1. Push-Pin Attachment Mechanism The "17B" and "R0" designations often refer to the specific mounting hardware. This model uses a **plastic push-pin** with a compression spring. * **Purpose:** Ensures consistent pressure on the electronic component to maximize thermal transfer. * **Benefit:** Allows for quick, tool-free installation on a PCB with pre-drilled holes. #### 2. Cross-Cut Fin Design Unlike traditional straight-fin heat sinks, the ATS-17B-90-C2-R0 features a **cross-cut** (pin-fin style) pattern. * **Efficiency:** This design increases surface area and creates turbulence in the airflow, which helps dissipate heat more effectively in low-airflow environments. #### 3. Pre-applied Thermal Interface (T766) The part comes with **T766 phase-change material** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance compared to a dry mount. #### 4. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** Not only provides a professional aesthetic but also increases the surface emissivity and protects the aluminum from corrosion/oxidation. --- ### Applications in Electronics This specific heat sink is typically found in: * **Networking Equipment:** Routers, switches, and modems. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.