The **ATS-17B-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "pushPIN™" series. --- ### 1. Technical Specifications The part number provides specific details about its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 40.00 mm x 40.00 mm | | **Height** | 12.70 mm | | **Pitch/Pattern** | 45.00 mm (Hole-to-hole) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design #### A. The Fin Design (High Performance) The "17B" series often utilizes a **cross-cut** or **straight fin** geometry. This allows for multi-directional airflow, which is critical in dense electronic enclosures where the direction of the cooling fan might not be perfectly aligned with the heatsink. #### B. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the pushPIN™ system uses a flexible "Spring & Pin" mechanism: * **Compression Springs:** Ensure even pressure across the electronic chip (CPU/GPU/FPGA), maximizing heat transfer. * **Hardware:** Usually consists of brass or plastic pins that lock into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. In electronics, the TIM is essential because it fills microscopic air gaps between the heatsink and the component, significantly reducing thermal resistance. --- ### 3. Applications This specific heatsink is typically found in the following electronic environments: * **Networking Equipment:** Routers and switches where high-speed processors generate significant heat. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Industrial PCs:** Compact systems that require reliable, mechanical attachment of cooling parts to survive vibration. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 16.48 | 6.66 | 3.76 | 2.72 |