ATS-17D-01-C2-R0
AI

The **ATS-17D-01-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their **pushPIN™** assembly line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body), Blue Anodized (Finish) |
| **Attachment Type** | pushPIN™ (Spring-loaded pins) |
| **Heat Sink Type** | XCUT (Cross-cut fins) |
| **Dimensions** | 40mm x 40mm x 10mm |
| **Thermal Resistance (Unducted)** | 21.93 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 3.63 °C/W @ 100 LFM |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Breakdown of Electronic/Mechanical Parts
#### A. The Heat Sink Body (XCUT Design)
The core of the unit is a cross-cut aluminum block. The "XCUT" design allows for omnidirectional airflow. Unlike straight-fin heat sinks that require air to flow in one specific direction, cross-cut fins capture air from any angle, making it ideal for crowded PCB layouts where airflow direction is unpredictable.
#### B. The pushPIN™ Attachment System
Instead of using messy adhesives or simple clips, this part uses a standardized push-pin mechanism:
* **Pins:** Usually made of brass or plastic, these lock into pre-drilled holes in the PCB.
* **Springs:** Provides consistent **Interface Pressure**. This is critical for electronics because it ensures the heat sink stays in flush contact with the component, even during thermal expansion or vibration.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base.
* **Purpose:** It fills microscopic air gaps between the heat sink and the electronic chip.
* **Advantage:** Pre-application ensures an even layer, reducing the risk of "hot spots" caused by manual application errors.
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### 3. Application Use Cases
* **BGA Cooling:** Used for Ball Grid Array chips that generate moderate heat.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Embedded Systems:** Ideal for low-profile industrial PCs where vertical space is limited to 10mm.
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- ⤷
What is the significance of the 'C2' code in the part number regarding material or color?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ What are the PCB hole requirements for mounting the pushPIN system?