The **ATS-17D-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" line designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 10.00mm | | **Fin Type** | XCUT (Cross-cut) | | **Thermal Resistance** | 22.05 °C/W (at 100 LFM) to 5.92 °C/W (at 700 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Features and Components #### A. XCUT Fin Profile This model uses an **XCUT** design. Unlike straight-fin heat sinks, XCUT designs allow for multi-directional airflow. This is critical in cramped electronic enclosures where air may not flow in a single predictable path. #### B. pushPIN™ Attachment Mechanism The "D" in the part number signifies the attachment type. The pushPIN™ system uses: * **Compression Springs:** Provides precise pressure (approx. 20+ PSI) to ensure optimal contact with the chip. * **Brass/Plastic Pins:** Securely locks the heat sink into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (T412) The unit comes with **T412** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the component's surface and the heat sink, maximizing heat transfer. --- ### 3. Application Use-Cases This specific heat sink is typically used for cooling the following electronic parts: 1. **Processors (CPUs/GPUs):** Low-profile cooling for embedded systems. 2. **FPGAs & ASICs:** High-density chips used in networking and telecommunications. 3. **Power Electronics:** Voltage regulators or power modules that generate localized heat. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 22.05 | | 300 | 9.50 | | 500 | 6.77 | | 700 | 5.92 |