## Electronic Specifications: ATS-17D-03-C2-R0 The **ATS-17D-03-C2-R0** is a high-performance push-pin heat sink designed by Advanced Thermal Solutions (ATS). While it is a mechanical component, its specifications are critical for the thermal management of electronic Integrated Circuits (ICs) and CPUs. --- ### 1. General Product Overview This part belongs to the **push-pin** heat sink family, utilizing a flexible attachment mechanism that allows for secure mounting to PCBs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17D-03-C2-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Type** | Push-Pin (Brass or Plastic options) | --- ### 2. Physical Dimensions The physical footprint determines which electronic components (such as BGAs or FPGAs) the heat sink can effectively cover. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 15.00 mm * **Pin Pitch:** 33.00 mm (Distance between mounting holes) --- ### 3. Thermal Performance Data The "Electronic" part of this component refers to its ability to dissipate heat (Watts) generated by an electronic device based on airflow (LFM - Linear Feet per Minute). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) - Unducted | Thermal Resistance (°C/W) - Ducted | | :--- | :--- | :--- | | 100 (0.5 m/s) | 26.24 | 2.81 | | 200 (1.0 m/s) | 11.66 | 2.11 | | 300 (1.5 m/s) | 7.04 | 1.78 | | 400 (2.0 m/s) | 5.10 | 1.58 | | 500 (2.5 m/s) | 4.16 | 1.44 | --- ### 4. Key Electronic Design Features 1. **Fin Design:** Features a **fine-pitch** fin pattern that maximizes surface area for heat transfer in constrained electronic enclosures. 2. **Thermal Interface Material (TIM):** The part typically comes pre-applied with **T766** phase-change material, ensuring high-quality thermal contact between the heat sink and the electronic chip. 3. **EMI Shielding Compatibility:** The low profile and aluminum construction are designed to avoid interference with localized electromagnetic signals on the PCB. 4. **Spring Tension:** Equipped with a pre-assembled spring to ensure the correct pressure is applied to the chip, preventing damage to delicate solder balls (BGA) while maintaining thermal efficiency. ---