The **ATS-17D-05-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** family of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Active/Passive Cooling) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 11.46° C/W (at 100 LFM) | | **Airflow Pattern** | Vertical (Fine Pitch) | --- ## 2. Key Features and Design ### A. Material and Finish The unit is constructed from high-grade aluminum, providing a balance between weight and thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and increases the emissivity of the heat sink, slightly improving radiant heat transfer. ### B. The pushPIN™ Attachment System One of the defining features of this part is the attachment mechanism: * **Ease of Assembly:** Uses a spring-loaded push-pin to secure the heat sink to the PCB. * **Constant Pressure:** The springs ensure consistent pressure on the thermal interface material (TIM), optimizing heat transfer from the chip to the sink. * **Pre-Drilled Holes:** This model is designed for a specific hole pattern on the PCB (typically 33mm pitch for this size). ### C. Thermal Performance The "fine pitch" design consists of multiple thin fins that increase the total surface area. This allows for efficient heat dissipation in systems with forced air (fans). --- ## 3. Part Number Breakdown The part number follows a specific nomenclature: * **ATS**: Advanced Thermal Solutions (Manufacturer) * **17**: Series number * **D**: Fin design/Density * **05**: Specific size/geometry identifier * **C2**: Thermal Interface Material (TIM) and spring tension code * **R0**: Revision/RoHS compliance status --- ## 4. Typical Applications * **Embedded Systems:** Cooling CPUs or GPUs on industrial motherboards. * **Telecommunications:** Dissipating heat from high-speed network switches. * **Power Supplies:** Cooling voltage regulators or power transistors.