## Technical Overview of ATS-17D-07-C2-R0 The **ATS-17D-07-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment family, specifically engineered for cooling electronic components such as processors, BGA (Ball Grid Array) packages, and other heat-generating semiconductors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Thermal Resistance (Flowing Air)** | 3.30 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 6.30 °C/W | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design and Construction #### A. The Heat Sink Body The unit is made from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly improves radiant heat transfer. #### B. Fin Configuration It utilizes a **Straight Fin** design. This is optimized for systems where there is a clear, directional airflow (forced convection). The spacing between fins is calculated to minimize pressure drop while maximizing the surface area for heat dissipation. #### C. Push-Pin Attachment Instead of using adhesive tapes which can degrade over time, this part uses a **plastic push-pin and spring** mechanism. * **Pressure:** The spring ensures consistent pressure on the component, improving the efficiency of the Thermal Interface Material (TIM). * **Reliability:** Mechanical fastening is more secure in high-vibration environments. --- ### 3. Thermal Interface Material (TIM): T766 The "C2" in the part number denotes the use of **T766** thermal grease. * It is pre-applied to the base of the heat sink. * It serves to fill microscopic air gaps between the component surface and the heat sink base, significantly reducing contact resistance. --- ### 4. Application Context This specific model is typically used for: * **Telecommunications:** Cooling ASICs in networking switches. * **Embedded Computing:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs or power modules. --- ### 5. Part Number Breakdown * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17**: Series number. * **D**: Pin/Spring attachment type. * **07**: Specific size/height configuration. * **C2**: Thermal Interface Material (T766). * **R0**: RoHS Compliant (Revision status). ---