### Overview of ATS-17D-10-C2-R0 The **ATS-17D-10-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs that generate significant heat during operation. --- ### 1. Technical Specifications The following table highlights the critical physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Height Off Base)** | 25mm | | **Thermal Resistance** | 7.89°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. pushPIN™ Attachment System This component features a specialized push-pin mechanism. This is crucial for electronic assembly because: * **Constant Pressure:** It ensures uniform pressure across the component surface, maximizing heat transfer. * **Tool-less Installation:** The pins allow for quick installation onto the PCB without complex mounting hardware. #### B. Heat Sink Design (Straight Fin) The **ATS-17D-10-C2-R0** utilizes a **Straight Fin** geometry. * **Airflow Efficiency:** This design is optimized for environments where there is a consistent, directional airflow (forced convection). * **Pitch:** The fin pitch is calculated to minimize pressure drop while maximizing the surface area available for cooling. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Performance:** T766 is a high-performance phase-change or grease-like material designed to lower the thermal impedance at the contact point. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications:** Cooling signal processors in base stations. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Cooling MOSFETs or power modules in conversion circuits. ---