The **ATS-17D-124-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** family, designed for efficient heat dissipation in electronic components like CPUs, GPUs, and other integrated circuits. --- ### ## Technical Specifications The following table outlines the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm | | **Fin Pattern** | Fine-Pitch | | **Thermal Resistance** | 3.20° C/W (Unducted flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ### Core Electronic/Thermal Components 1. **Heat Sink Body**: The core is made of Aluminum, chosen for its high thermal conductivity and lightweight properties. The "Fine-Pitch" design increases the surface area, allowing for better heat transfer to the surrounding air. 2. **Spring-Loaded pushPIN™**: Unlike adhesive tapes, this part uses a mechanical attachment system. It provides a consistent pressure (7-8 kgf) between the heat sink and the electronic component, ensuring the best possible thermal contact. 3. **T766 Thermal Interface Material (TIM)**: The base is pre-coated with a phase-change material. This fills the microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance. 4. **Compression Springs**: These are engineered to provide precise force to prevent the heat sink from shifting during vibration or shipping, protecting the delicate solder joints of the PCB. --- ### ### Performance Characteristics The efficiency of this part is highly dependent on airflow (measured in Linear Feet per Minute - LFM): * **100 LFM (0.5 m/s):** 4.70° C/W * **200 LFM (1.0 m/s):** 3.20° C/W * **500 LFM (2.5 m/s):** 2.20° C/W --- ### ### Installation & Usage The "C2" in the part number indicates the specific thermal interface material and hardware configuration. This part is typically used in servers, telecommunications equipment, and industrial computing where active airflow is present to assist the passive heat sink.