The **ATS-17D-13-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** from Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance (Flowing)** | 13.70°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.30°C/W @ 700 LFM | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Component Breakdown #### A. pushPIN™ Attachment System This part utilizes a specialized push-pin mechanism. This allows for: * **Uniform Pressure:** Ensures consistent contact between the heat sink base and the electronic component. * **Quick Assembly:** Designed for high-volume manufacturing with pre-drilled holes in the PCB. * **Secure Fit:** Brass or plastic pins with stainless steel springs provide high vibration resistance. #### B. Heat Sink Geometry (Fine Pitch) The "D" in the part number indicates a specific fin pattern. These are designed for **high-airflow environments**. The low-profile height (15mm) makes it ideal for dense electronic enclosures or 1U server racks where vertical space is limited. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the chip and the heat sink, significantly improving heat transfer efficiency. #### D. Blue Anodized Finish Beyond aesthetics, the blue anodization provides: * Increased corrosion resistance. * Electrical insulation (to prevent shorts if it touches adjacent components). * Enhanced emissivity for better radiative cooling. --- ### 3. Typical Applications * **Processors (CPUs/GPUs):** Cooling small-to-midsize logic chips. * **Telecommunications:** High-speed routers and networking hardware. * **Industrial Controls:** Power modules that generate localized heat on a PCB.