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  • ATS-17D-141-C2-R0

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    The **ATS-17D-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *push-pin* attachment series designed for cooling processors and integrated circuits. --- ### ## Technical Specifications Below are the primary technical characteristics of the ATS-17D-141-C2-R0: | Feature | Specification | | :--- | :--- | | **Product Category** | Passive Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 15.76°C/W (at 200 LFM) | | **Dimensions** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### ### Core Electronic Functions 1. **Passive Cooling**: This component does not require electricity to operate. It dissipates heat generated by electronic components (such as FPGAs, ASICs, or CPUs) into the surrounding air via convection. 2. **Heat Transfer Efficiency**: The "Blue Anodized" finish is not just for aesthetics; the anodization process increases the surface emissivity, slightly improving the radiative heat transfer. 3. **Thermal Interface Material (T766)**: The "C2" in the part number indicates the specific thermal grease or pad applied to the base. The T766 material fills microscopic air gaps between the chip and the heat sink to ensure maximum conductivity. --- ### ### Physical Design Details * **Push-Pin Mounting**: This part uses a 2-pin attachment system. The push-pins have a built-in spring mechanism that provides consistent pressure, ensuring the heat sink remains in firm contact with the electronic component even during vibration or mechanical shock. * **Fin Geometry**: The fins are designed to provide a large surface area while maintaining a low profile (10mm height), making it ideal for compact electronic enclosures or 1U server racks. --- ### ### Decoding the Part Number * **ATS**: Advanced Thermal Solutions (Manufacturer). * **17**: Series identifier. * **D**: Material/Fin style code. * **141**: Specific size/dimension profile. * **C2**: Thermal Interface Material type (T766). * **R0**: Revision/RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What is the maximum power dissipation (in Watts) this heat sink can handle?
    • ⤷ How do I calculate the required airflow (LFM) for this specific model?
    • ⤷ Are there alternative mounting options if my PCB doesn't have push-pin holes?