ATS-17D-142-C2-R0
AI

The **ATS-17D-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here are the core technical details for this specific model:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 4.72°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm |
| **Fin Style** | Straight Fin |
| **Compliance** | RoHS and REACH Compliant |
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## 2. Component Breakdown
### A. The Heat Sink Body
* **Straight Fin Design:** This model utilizes a straight fin pattern, which is optimized for **forced air cooling** (where a fan is used). The layout allows air to flow through the channels with minimal resistance.
* **Aluminum Construction:** Aluminum is used for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** coating protects the metal from corrosion and increases emissivity for better radiant heat loss.
### B. The pushPIN™ Attachment System
Instead of using messy adhesives or simple clips, the **ATS-17D-142-C2-R0** uses a specialized pushPIN™ system:
1. **Spring-Loaded Pins:** These ensure a consistent, pre-determined pressure is applied to the component, ensuring maximum thermal contact.
2. **Brass Components:** The pins are typically made of brass or steel for durability during installation.
### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number usually indicates that the heat sink comes with a pre-applied **Thermal Interface Material**. This is the layer that sits between the chip and the heat sink to fill microscopic air gaps and facilitate heat transfer.
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## 3. Performance Data (Airflow)
Thermal resistance varies based on the speed of the air flowing through the fins:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 10.07 |
| 200 (1.0 m/s) | 4.72 |
| 300 (1.5 m/s) | 3.52 |
| 400 (2.0 m/s) | 3.01 |
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- ⤷
How does the 'pushPIN' attachment compare to traditional thermal adhesive?
- ⤷ What are the specific hole patterns required on the PCB for this heat sink?
- ⤷ Can this heat sink be used for passive cooling without a fan?