The **ATS-17D-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50mm x 50mm x 25mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 7.44 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps in identifying the specific configuration: - **ATS-17**: Series identifier (Advanced Thermal Solutions). - **D**: Fin pattern or density designation. - **15**: Specific height or size iteration. - **C2**: Material and finish code (typically Aluminum with Blue Anodize). - **R0**: Revision or packaging code. --- ### 3. Key Electronic/Mechanical Features #### A. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a **pushPIN™** mechanism. This consists of a brass or plastic pin with a compressed spring that provides precise pressure to the processor or component, ensuring optimal contact with the Thermal Interface Material (TIM). #### B. High-Performance Fin Design The heat sink features a **Fine-Pitch** design. In electronics, this is critical because it increases the surface area available for heat dissipation without significantly increasing the footprint of the component. It is designed for "cross-flow" or "ducted" air environments. #### C. Pre-applied TIM (T766) The "C2-R0" variant comes with **T766 thermal grease** pre-applied to the base. This eliminates the need for manual application, reducing the risk of air bubbles (voids) which can impede heat transfer from the semiconductor to the aluminum fins. --- ### 4. Common Applications This specific heat sink is typically used for cooling: * **CPUs/GPUs:** Medium-power processors. * **ASICs/FPGAs:** Custom integrated circuits in networking gear. * **Power Supplies:** High-voltage components requiring active or passive cooling. ---