The **ATS-17D-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Fin Type** | Square-Cut (Cross-Cut) | | **Attachment Type** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Finish** | Blue Anodized | | **Thermal Resistance** | 18.08 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the specific configuration of the part: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **17**: Series identifier. * **D**: Pin/Attachment material (usually indicates a specific spring or pin type). * **16**: Specific size/designator within the series. * **C2**: Refers to the thermal performance/material (Aluminum with Blue Anodized finish). * **R0**: Revision or packaging indicator. --- ### 3. Key Features and Applications #### Design Characteristics - **Low Profile:** At only 10mm high, it is ideal for space-constrained applications like 1U servers or mobile devices. - **Efficient Airflow:** The cross-cut fin design allows for multi-directional airflow, making it effective even if the orientation of the fan or air source isn't perfectly aligned. - **Secure Mounting:** The pushPIN™ mechanism uses a brass or plastic pin and a stainless steel spring to provide precise pressure on the component, ensuring optimal heat transfer without damaging the PCB. #### Typical Use Cases 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Embedded Systems:** Industrial PCs where vertical clearance is minimal. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 4. **Telecommunications:** Cooling RF components or signal processors. --- ### 4. Thermal Performance Comparison *Thermal resistance measured in °C/W (Lower is better).* | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 18.08 | 4.45 | 2.50 | | **Ducted Flow** | 3.50 | 2.00 | 1.60 |