The **ATS-17D-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number provides specific details regarding its dimensions, material, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.74 °C/W (at 100 LFM) | | **Fin Pattern** | COARSE-PITCH (Straight fin) | --- ### 2. Physical Dimensions Precision measurements are critical for ensuring the heat sink fits within the PCB (Printed Circuit Board) layout constraints. | Dimension Label | Measurement | | :--- | :--- | | **Dimension A (Length)** | 45.00 mm | | **Dimension B (Width)** | 45.00 mm | | **Dimension C (Height)** | 20.00 mm | | **Dimension E (Pitch)** | 38.00 mm | | **Dimension F (Pitch)** | 38.00 mm | --- ### 3. Key Features * **pushPIN™ Attachment:** Uses a flexible attachment system that includes a brass or plastic pin and a high-performance compression spring to ensure secure contact with the component. * **Pre-drilled Holes:** The base is pre-drilled to match industry-standard hole patterns for easy installation. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink and the chip. * **High Flow Design:** The coarse-pitch fin design is optimized for environments with low-to-medium airflow, preventing dust clogging while maximizing surface area. --- ### 4. Part Number Breakdown The suffixing in the part number provides additional configuration details: * **-C2:** Refers to the material and finish (typically Aluminum with a Blue Anodized coating). * **-R0:** Indicates the revision or packaging standard of the component. --- ### 5. Application This part is commonly found in: * **Telecommunications:** Cooling of high-speed processors and ASICs. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and MOSFET cooling.