ATS-17D-191-C2-R0
AI

The **ATS-17D-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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### 1. Technical Specifications
This specific model belongs to the **pushPIN™** series, known for its standardized mounting system.
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-17D-191-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 2.90 °C/W (at 100 LFM) |
| **Dimensions** | 45mm x 45mm x 30mm |
| **Weight** | 68.61 grams |
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### 2. Physical Design Features
The "electronic parts" of this assembly include the heat sink body and the mounting hardware:
* **Heat Sink Body (Cross-Cut Fin):** The fin design is optimized for multidirectional airflow. The "Cross-Cut" pattern allows air to enter from different angles, making it ideal for enclosures where airflow direction might not be strictly linear.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** (or similar high-performance grease). The TIM fills microscopic air gaps between the electronic component (die) and the heat sink base to maximize heat transfer.
* **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a mechanical attachment consisting of:
* **Brass/Plastic Push-Pins:** To lock the sink into pre-drilled PCB holes.
* **Stainless Steel Springs:** Provide precise, consistent pressure (preload) to ensure optimal contact with the electronic chip.
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### 3. Thermal Performance Indicators
The part is engineered to manage specific thermal loads. Below is the performance under different airflow conditions:
| Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 2.90 |
| 300 | 1.5 | 1.48 |
| 500 | 2.5 | 1.16 |
| 700 | 3.5 | 1.01 |
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### 4. Summary of Part Number Suffixes
* **-C2:** Indicates the thermal performance and material grade (usually high-performance aluminum with specific anodization).
* **-R0:** Refers to the revision code or packaging standard.
- ⤷
What are the PCB hole diameter requirements for the pushPIN mounting system?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?
- ⤷ How does the 'Blue Anodized' finish affect the emissivity and thermal performance?