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  • ATS-17D-191-C2-R0

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    The **ATS-17D-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications This specific model belongs to the **pushPIN™** series, known for its standardized mounting system. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17D-191-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.90 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 30mm | | **Weight** | 68.61 grams | --- ### 2. Physical Design Features The "electronic parts" of this assembly include the heat sink body and the mounting hardware: * **Heat Sink Body (Cross-Cut Fin):** The fin design is optimized for multidirectional airflow. The "Cross-Cut" pattern allows air to enter from different angles, making it ideal for enclosures where airflow direction might not be strictly linear. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** (or similar high-performance grease). The TIM fills microscopic air gaps between the electronic component (die) and the heat sink base to maximize heat transfer. * **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a mechanical attachment consisting of: * **Brass/Plastic Push-Pins:** To lock the sink into pre-drilled PCB holes. * **Stainless Steel Springs:** Provide precise, consistent pressure (preload) to ensure optimal contact with the electronic chip. --- ### 3. Thermal Performance Indicators The part is engineered to manage specific thermal loads. Below is the performance under different airflow conditions: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.90 | | 300 | 1.5 | 1.48 | | 500 | 2.5 | 1.16 | | 700 | 3.5 | 1.01 | --- ### 4. Summary of Part Number Suffixes * **-C2:** Indicates the thermal performance and material grade (usually high-performance aluminum with specific anodization). * **-R0:** Refers to the revision code or packaging standard.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN mounting system?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?
    • ⤷ How does the 'Blue Anodized' finish affect the emissivity and thermal performance?