The **ATS-17D-192-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic cooling component designed specifically for high-density electronic packaging, such as BGA (Ball Grid Array) components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.35°C/W (at 200 LFM) | | **Flow Direction** | Vertical / Omni-directional (Pin Fin) | --- ## 2. Key Component Features ### A. Pin Fin Design Unlike traditional straight-fin heat sinks, this model uses a **Pin Fin** array. - **Efficiency:** Provides high surface area and allows for air to flow from any direction (omni-directional). - **Turbulence:** The pins break up the boundary layer of air, increasing heat transfer efficiency compared to standard extrusion profiles. ### B. pushPIN™ Attachment System This part utilizes a specific mounting mechanism: - **Plastic/Brass Pins:** Integrated pins and springs provide a secure, consistent pressure on the processor or chip. - **Pre-drilled Holes:** Requires specific hole patterns on the PCB for mounting. - **Reliability:** Ensures the heat sink stays in place during shock or vibration. ### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with **T766** pre-applied thermal interface material (phase-change material). This ensures a low thermal resistance bond between the component surface and the aluminum base. --- ## 3. Thermal Performance (Estimated) Performance is measured by how much the temperature rises per watt of power dissipated ($^\circ C/W$). | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 4.43 | 2.35 | 1.90 | 1.66 | 1.50 | --- ## 4. Typical Applications * **Networking Gear:** Switches and routers. * **Embedded Systems:** High-power ARM or FPGA modules. * **Power Electronics:** Voltage regulators and power supplies where space is at a premium but heat dissipation is critical.