The **ATS-17D-20-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17D-20-C2-R0 | | **Component Type** | Passive Heat Sink | | **Attachment Method** | superGRIP (Clip-on) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 7.14°C/W (Natural Convection) | | **RoHS Status** | Compliant | --- ## 2. Key Electronic Features ### A. Thermal Performance This part is designed to dissipate heat from high-power integrated circuits (ICs). - **Convection:** It performs optimally in forced-air environments (fans), but provides a baseline resistance of **7.14°C/W** in static air. - **Fin Design:** It uses a "Pin Fin" or "Cross-Cut" geometry, which allows for multi-directional airflow, making it effective regardless of how the board is oriented. ### B. superGRIP™ Attachment Technology Unlike traditional heatsinks that require holes drilled into the PCB, this model uses a high-strength plastic frame clip. - **No Holes Required:** The clip attaches directly to the component, saving PCB real estate. - **Uniform Pressure:** It applies consistent pressure to the Thermal Interface Material (TIM), ensuring efficient heat transfer. ### C. Material and Coating - **Aluminum Alloy:** Provides a lightweight solution with high thermal conductivity. - **Blue Anodization:** This is not just for aesthetics; the anodized coating increases surface emissivity and protects the aluminum from corrosion and electrical shorting if it accidentally touches a lead. --- ## 3. Applications This heatsink is typically found in: * **Networking Gear:** Routers, switches, and gateways. * **Embedded Computing:** High-speed processors and FPGAs. * **Power Supplies:** Cooling voltage regulators or power modules. * **Telecommunications:** Base station equipment. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **17** | Series Number (superGRIP) | | **D** | Fin Pattern / Geometry | | **20** | Height Code (25mm) | | **C2** | Thermal Interface Material (TIM) type included | | **R0** | Revision / Standard Packaging |