ATS-17D-27-C2-R0
AI

The **ATS-17D-27-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies.
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## 1. Component Overview
This part belongs to the **blueICE™** series of heat sinks. It is specifically designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs that generate significant thermal energy.
### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-17D-27-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 12.24°C/W (Unducted) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm |
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## 2. Key Design Features
### A. pushPIN™ Attachment System
The "17D" series utilizes the **pushPIN™** system, which simplifies the mounting process.
* **Ease of Use:** It eliminates the need for messy adhesives or complicated mounting clips.
* **Compression Springs:** It uses a flexible, high-performance spring that provides precise pressure across the interface to ensure maximum heat transfer.
### B. Material and Finish
* **Aluminum Construction:** Provides a lightweight yet highly conductive path for heat to move away from the chip.
* **Blue Anodized Coating:** The "C2" suffix indicates the blue anodized finish, which not only provides corrosion resistance but also slightly increases surface emissivity for better thermal radiation.
### C. Fin Geometry
The sink uses a **Straight Fin** or **Cross-Cut** design (depending on the specific revision) optimized for airflow. The 12.7mm height is considered "low profile," making it ideal for 1U server racks or compact industrial enclosures.
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## 3. Thermal Performance (Deg C/W)
Performance varies based on the airflow velocity (LFM - Linear Feet per Minute):
| Airflow Velocity (LFM) | 200 | 400 | 600 | 800 | 1000 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (Unducted)** | 12.24 | 5.97 | 3.83 | 2.85 | 2.28 |
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## 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variations:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **17:** Series identifier (Specific pin/fin pattern).
* **D:** Attachment style (pushPIN™).
* **27:** Dimensions/specific geometry code.
* **C2:** Material/Finish (Blue Anodized).
* **R0:** RoHS compliant (Standard environmental certification).
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What is the difference between ducted and unducted thermal resistance?
- ⤷ Are there different spring tensions available for the pushPIN system?
- ⤷ How do I calculate the required LFM for my specific processor's TDP?