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  • ATS-17D-27-C2-R0

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    The **ATS-17D-27-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies. --- ## 1. Component Overview This part belongs to the **blueICE™** series of heat sinks. It is specifically designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs that generate significant thermal energy. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17D-27-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.24°C/W (Unducted) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | --- ## 2. Key Design Features ### A. pushPIN™ Attachment System The "17D" series utilizes the **pushPIN™** system, which simplifies the mounting process. * **Ease of Use:** It eliminates the need for messy adhesives or complicated mounting clips. * **Compression Springs:** It uses a flexible, high-performance spring that provides precise pressure across the interface to ensure maximum heat transfer. ### B. Material and Finish * **Aluminum Construction:** Provides a lightweight yet highly conductive path for heat to move away from the chip. * **Blue Anodized Coating:** The "C2" suffix indicates the blue anodized finish, which not only provides corrosion resistance but also slightly increases surface emissivity for better thermal radiation. ### C. Fin Geometry The sink uses a **Straight Fin** or **Cross-Cut** design (depending on the specific revision) optimized for airflow. The 12.7mm height is considered "low profile," making it ideal for 1U server racks or compact industrial enclosures. --- ## 3. Thermal Performance (Deg C/W) Performance varies based on the airflow velocity (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | 200 | 400 | 600 | 800 | 1000 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 12.24 | 5.97 | 3.83 | 2.85 | 2.28 | --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variations: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **17:** Series identifier (Specific pin/fin pattern). * **D:** Attachment style (pushPIN™). * **27:** Dimensions/specific geometry code. * **C2:** Material/Finish (Blue Anodized). * **R0:** RoHS compliant (Standard environmental certification).
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance?
    • ⤷ Are there different spring tensions available for the pushPIN system?
    • ⤷ How do I calculate the required LFM for my specific processor's TDP?