The **ATS-17D-31-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its technical specifications and physical characteristics. ### 1. General Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). It is designed for easy installation and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-17D-31-C2-R0 | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the PCB layout and clears surrounding components. | Dimension | Value (mm) | Description | | :--- | :--- | :--- | | **Length (A)** | 57.90 mm | The base length of the heat sink | | **Width (B)** | 36.83 mm | The base width of the heat sink | | **Height (C)** | 6.00 mm | The height from the base to the top of fins | | **Pitch (E)** | 47.24 mm | Distance between mounting holes (Lengthwise) | | **Pitch (F)** | 26.16 mm | Distance between mounting holes (Widthwise) | --- ### 3. Key Electronic Cooling Features #### A. Fin Design (Fine Pitch) The "31" in the part number indicates a specific fin pattern. This model uses a **Fine Pitch** pattern with a **Straight Fin** design, which provides a large surface area for heat dissipation while maintaining a low profile (6mm). #### B. Thermal Interface Material (TIM) The "C2" suffix indicates that this part comes pre-applied with **T766 phase change material**. This acts as the bridge between the electronic component (like a CPU or FPGA) and the aluminum heat sink, filling microscopic air gaps to improve heat transfer. #### C. pushPIN™ Mounting System The system uses a brass or plastic pin with a stainless steel spring. This provides: * **Constant Pressure:** Ensures the TIM is compressed correctly for maximum conductivity. * **Secure Attachment:** Unlike adhesive tapes, the pins ensure the heat sink won't fall off during vibration or high-temperature cycles. --- ### 4. Application Usage This heat sink is typically used for: * **Low Profile Devices:** Because it is only 6mm tall, it fits in 1U servers or slim enclosures. * **High-Speed Logic:** Cooling FPGAs, ASICs, or Northbridge chipsets. * **Industrial PCs:** Where vibration resistance is required via mechanical mounting.