The **ATS-17D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The model number provides specific details about its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 35.00 mm x 35.00 mm | | **Height** | 10.00 mm | | **Thermal Resistance** | 12.83° C/W (@ 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ### 2. Core Components & Design #### A. The pushPIN™ Attachment Unlike adhesive-based heatsinks, this model uses a **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide precise, uniform pressure (measured in "Force") across the component surface to ensure maximum thermal contact. #### B. The Thermal Interface Material (TIM) The "C2" in the part number indicates the type of pre-applied Thermal Interface Material. * **T766:** This is a high-performance phase-change material or grease that fills microscopic air gaps between the chip and the aluminum base, significantly reducing thermal resistance. #### C. Fin Geometry * **Straight Fin:** Designed for "tunnel" airflow or specific directional cooling. * **Low Profile:** At only 10mm high, it is ideal for space-constrained applications like 1U servers or compact embedded systems. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **17** | Series (pushPIN™ Heatsink Series) | | **D** | Attachment Hole Pattern | | **35** | Footprint Size (35mm) | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant Version | --- ### 4. Application Use-Case This part is typically found on: 1. **Network Switches:** Cooling localized processors. 2. **Embedded Systems:** Industrial PCs where vibration resistance is needed (the springs prevent the heatsink from falling off due to shock). 3. **Power Supplies:** Cooling voltage regulators or MOSFETs.