The **ATS-17D-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself contains coded information regarding its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 15.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 14.82°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System The "17D" designation identifies the specific mounting mechanism. This system uses a spring-loaded push-pin to ensure: * **Constant Pressure:** Maintains optimal contact between the heat sink and the component surface. * **Ease of Assembly:** Can be installed manually or with basic tools into pre-drilled PCB holes. #### B. Thermal Interface Material (TIM) The "C2" suffix indicates the inclusion of a **T766 Phase Change Material**. * This is a pre-applied thermal pad on the base of the heat sink. * It eliminates the need for external thermal paste and ensures low thermal resistance at the interface. #### C. Fin Design and Airflow The heat sink utilizes a **Straight Fin** profile. * **Optimized for Airflow:** Designed to work efficiently with forced air (fans) or natural convection. * **Heat Dissipation:** The aluminum construction provides a high surface-area-to-weight ratio, which is critical for modern, densely packed PCBs. --- ### 3. Application Use Cases This specific model is typically found in: * **Embedded Systems:** Industrial PCs and controllers. * **Networking Gear:** Small routers, switches, and edge computing devices. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators (VRMs). ---