The **ATS-17D-39-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ## 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 18.94° C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Fins** | 48 Straight Fins | --- ## 2. Component Analysis ### Thermal Performance The "electronic" utility of this part is measured by its ability to dissipate heat. Thermal resistance values vary based on the airflow (measured in Linear Feet per Minute - LFM): * **@100 LFM (0.5 m/s):** 18.94° C/W * **@300 LFM (1.5 m/s):** 8.35° C/W * **@500 LFM (2.5 m/s):** 6.39° C/W ### Mechanical Attachment The **C2** designation in the part number refers to the attachment and interface material: * **Push Pin:** Uses a spring-loaded brass pin system to ensure even pressure across the electronic component (IC). * **Thermal Interface Material (TIM):** Pre-applied **T766** (a high-performance thermal grease or pad) to maximize heat transfer from the chip to the aluminum. --- ## 3. Part Number Decoder Understanding the nomenclature helps in identifying its application: | Segment | Meaning | | :--- | :--- | | **ATS-17D** | ATS series and specific mechanical mounting footprint. | | **39** | The length/width dimension code (30mm x 30mm). | | **C2** | Thermal interface material (T766) and finish color. | | **R0** | Revision code/Standard packaging. | --- ## 4. Typical Applications This heat sink is used for medium-density electronic cooling where vertical space (20mm) is available: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Industrial PCs:** Cooling embedded CPU modules. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs).