ATS-17D-47-C2-R0
AI

The **ATS-17D-47-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The following table outlines the key physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Heat Sink Type** | Top Mount / Cross-cut |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin |
| **Dimensions (L x W x H)** | 25mm x 25mm x 30mm |
| **Thermal Resistance** | 3.69°C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### Key Electronic Components & Design Features
#### 1. Push-Pin Attachment Mechanism
Instead of using messy adhesives or complex clips, this part uses a **brass push-pin** with a **stainless steel spring**. This provides:
* **Constant Pressure:** Ensures the heat sink maintains firm contact with the electronic chip for optimal heat transfer.
* **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping.
#### 2. Thermal Interface Material (TIM)
The "C2" in the part number indicates the use of **T766 thermal grease**.
* This is a high-performance material pre-applied to the base.
* It fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance.
#### 3. Fin Design (Cross-Cut)
The heat sink features a **cross-cut fin pattern**, which is critical for electronic enclosures with multi-directional airflow. Unlike straight-fin heat sinks that require air to blow in one specific direction, cross-cut fins allow air to enter from various angles, increasing turbulence and cooling efficiency.
#### 4. Material and Finish
* **Aluminum Body:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodization process increases surface emissivity and provides corrosion resistance for the aluminum.
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### Common Applications
* **Embedded Systems:** Cooling small form-factor processors.
* **Telecommunications:** Dissipating heat from high-speed networking chips.
* **Power Supplies:** Managing the thermal load of voltage regulators.
- ⤷
How does the thermal resistance of this heat sink change under high airflow (LFM)?
- ⤷ Is the T766 thermal interface material electrically conductive?
- ⤷ What are the PCB hole requirements for the push-pin mounting system?