The **ATS-17D-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table breaks down the critical physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 7.50 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.29 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Pitch** | Fine Pitch | | **Pattern** | XC-CUT | --- ### 2. Key Design Features * **XC-CUT Pattern:** This refers to the fin geometry. XC-CUT designs feature cross-cut fins that allow for multidirectional airflow. This is ideal for crowded PCB environments where airflow might come from various angles. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a spring-loaded pin mechanism. This ensures: * **Consistent Pressure:** Provides optimal contact with the electronic component. * **Durability:** Pre-assembled springs (brass or plastic) provide high vibration resistance. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied thermal grease, which fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the component's variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **17** | Series Number | | **D** | Attachment Type (pushPIN™) | | **48** | Dimension Identifier | | **C2** | Thermal Performance/Material Grade | | **R0** | Revision/Packaging Code | --- ### 4. Implementation Example In a circuit design, this component would be mounted over a high-heat SMD (Surface Mount Device). ```yaml Application: Voltage Regulator Cooling Component_Size: 25x25mm Mounting_Holes: 2-hole configuration Airflow_Required: Minimum 100 LFM (Linear Feet per Minute) ```