The **ATS-17D-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Specification | Value | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the *pushPIN™* series | | **Base Dimensions** | 35.0mm x 35.0mm | The square footprint of the heat sink | | **Height** | 25.00mm | The vertical profile (fin height + base) | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance | | **Thermal Resistance** | 10.79°C/W (Unducted) | Performance at 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin mechanism | --- ### 2. Key Electronic Components & Design The "D" and "52" in the part number refer to specific design configurations within the ATS catalog: * **Fine Pitch Fins:** This model typically features a high-density fin arrangement. This maximizes the surface area available for heat exchange within a small 35mm footprint. * **Push-Pin Attachment:** Unlike adhesive-based heat sinks, this uses a **mechanical push-pin system**. This ensures consistent pressure between the heat sink and the electronic component, which optimizes thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** The part usually comes pre-applied with **T766** or similar high-performance thermal grease, ensuring an airtight bond between the component die and the aluminum base. --- ### 3. Application Use Cases This specific heat sink is categorized as a "High Performance" cooling solution for: 1. **Telecommunications:** Cooling ASICs in networking switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 25mm. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow increases. Below is the typical performance curve for this series: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 10.79 | | 2.0 m/s (400 LFM) | 4.30 | | 3.0 m/s (600 LFM) | 3.12 |