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  • ATS-17D-56-C2-R0

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    ### Overview: ATS-17D-56-C2-R0 The **ATS-17D-56-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for thermal management of electronic components such as CPUs, GPUs, FPGAs, and ASICs where space is limited but high heat dissipation is required. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Leading provider of thermal management | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface area and corrosion resistance | | **Thermal Resistance** | 1.83 °C/W | Efficiency at 200 LFM (Linear Feet per Minute) | | **Dimensions** | 40mm x 40mm | Square base footprint | | **Height** | 15mm | Low-profile design | | **Attachment Method** | pushPIN™ | Spring-loaded attachment system | --- ### 2. Design and Construction The **ATS-17D-56-C2-R0** belongs to the **pushPIN™** series, which is engineered for secure and easy mounting on Printed Circuit Boards (PCBs). #### Key Components: 1. **High-Efficiency Fin Design:** * The fins are arranged to maximize surface area contact with air. * The cross-cut design allows for airflow from multiple directions, making it ideal for systems with complex internal air currents. 2. **Push-Pin Attachment:** * Uses a brass or plastic pin with a high-tension spring. * Provides a precise "click" to ensure the heat sink is correctly seated. * Ensures consistent pressure on the component to maximize thermal transfer through the interface material. 3. **Thermal Interface Material (TIM):** * Comes pre-applied with **T766** phase-change material or similar, reducing the need for manual thermal paste application. --- ### 3. Thermal Performance Analysis Thermal resistance ($\theta$) is measured in Degrees Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.83 | | **300 (1.5 m/s)** | 1.58 | | **400 (2.0 m/s)** | 1.45 | | **500 (2.5 m/s)** | 1.36 | --- ### 4. Part Number Breakdown Understanding the code helps in selecting variants: ```text ATS - 17 D - 56 - C2 - R0 | | | | | | | | | | | +-- Revision/RoHS Compliance | | | | +------- Finish (Blue Anodized) | | | +------------ Height (15mm) | | +----------------- Pin Count/Attachment Style | +------------------- Fin Style/Series +------------------------- Advanced Thermal Solutions ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN™ mounting system used in this heat sink?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ How does the blue anodized finish impact the thermal radiation compared to a plain aluminum finish?