The **ATS-17D-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17D-57-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 13.16°C/W (at 200 LFM) | | **Fin Style** | Straight (Cross-Cut) | --- ### 2. Key Component Features #### A. Material and Finish The unit is crafted from **Aluminum 6063**, providing a lightweight yet effective medium for heat dissipation. The **Blue Anodized** finish is not merely aesthetic; it provides increased surface emissivity and protects the metal from corrosion. #### B. Attachment Mechanism (Push-Pin) This part uses a specific mounting system: * **Spring-Loaded Push Pins:** These ensure consistent pressure (Normal Force) between the heat sink and the electronic component (CPU, FPGA, etc.), optimizing thermal transfer. * **Brass Pins:** The "R0" designation typically indicates a brass push pin, which offers high durability and reliability during installation. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal interface material. This eliminates the need for manual application of thermal paste and ensures a low thermal resistance path from the chip to the sink. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling medium-power electronics where airflow is present. * **Processors:** Cooling small CPUs or microcontrollers. * **FPGAs & ASICs:** Managing heat in programmable logic devices. * **Networking Gear:** Used in switches and routers for high-speed data chips. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 13.16 | | **300 (1.5 m/s)** | 3.96 | | **500 (2.5 m/s)** | 2.90 |