The part number **ATS-17D-63-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Type** | Closed-Hole (Cross-Cut) | | **Thermal Resistance** | 2.85 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps in identifying the specific physical characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17**: Represents the specific family/series. * **D**: Material/Fin configuration code. * **63**: Identification code for specific physical dimensions. * **C2**: Refers to the thermal performance and mounting hardware (often indicating a specific spring/pin combination). * **R0**: Finish/RoHS status (R0 typically indicates Blue Anodized finish). --- ### 3. Key Electronic Cooling Features * **Cross-Cut Fin Design**: The fins are not just straight lines; they are cut in a grid-like pattern. This increases surface area and allows for airflow from multiple directions, which is critical in tight electronic enclosures. * **Push-Pin Attachment**: This mechanism uses a compression spring and a plastic/brass pin. It provides a consistent "clamping force" (pressure) on the electronic chip, ensuring the thermal interface material (TIM) works efficiently. * **Pre-applied Thermal Interface Material (TIM)**: These units usually come with a high-performance thermal pad or grease pre-applied to the base to reduce assembly time and thermal resistance between the component and the sink. --- ### 4. Typical Applications * **Telecommunications**: Cooling line cards and routers. * **Embedded Systems**: Industrial PCs and IoT gateways. * **Power Supplies**: Dissipating heat from MOSFETs and voltage regulators.