The **ATS-17D-65-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, or power modules. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance (Low Flow)** | 7.29 °C/W @ 100 LFM | | **Thermal Resistance (High Flow)** | 1.39 °C/W @ 700 LFM | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Height off Base)** | 25mm | | **Material** | Aluminum | | **Fin Type** | Fine Pitch (straight fins) | | **Attachment Method** | Push-Pin (Plastic or Brass) | --- ## 2. Key Electronic Features ### A. Material and Finish * **Aluminum Construction:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** The "C2" suffix indicates a blue anodized coating. This is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. ### B. Thermal Performance The "R0" at the end of the part number signifies that the product is **RoHS and REACH compliant**, meaning it is free from hazardous substances like lead or mercury, making it safe for modern electronic circuit boards. ### C. Attachment Mechanism (pushPIN™) Unlike simple adhesive heat sinks, this model uses a mechanical **Push-Pin** system. * **Constant Pressure:** A pre-assembled compression spring ensures consistent pressure against the electronic component for maximum heat transfer. * **Secure Fit:** It requires pre-drilled holes in the PCB, preventing the heat sink from shifting during shipping or high-vibration environments. --- ## 3. Application Use Cases This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where airflow might be restricted.