The **ATS-17D-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 25mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 0.89°C/W (at 200 LFM) | | **Fin Style** | Straight (Vertical) | --- ### 2. Design and Component Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **ATS-17D-70-C2-R0** uses a specialized push-pin system. This ensures: * **Constant Pressure:** A high-performance compression spring provides precise, uniform pressure across the interface. * **Reliability:** It prevents the heatsink from shifting during mechanical shock or vibration. * **Ease of Assembly:** The plastic pins snap into pre-drilled holes (typically 3.175mm) on the PCB. #### B. Thermal Interface Material (TIM) This specific model comes pre-applied with **ATS-CPV2**, a high-performance thermal grease. This eliminates the need for manual application and ensures minimal air gaps between the component (CPU/GPU/FPGA) and the heatsink. #### C. Fin Geometry The heatsink features a **straight-fin** design. This is optimized for **forced air convection** (airflow from fans). The 25mm height allows for a significant surface area to dissipate heat while remaining compact enough for 1U or 2U rack-mount chassis environments. --- ### 3. Common Applications This part is typically found in high-heat density electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or IGBT modules. 4. **Computing:** Chipset or FPGA cooling on motherboards. --- ### 4. Part Number Breakdown The part number follows the ATS nomenclature: * **ATS:** Manufacturer prefix. * **17:** Specific series/form factor. * **D:** Pin configuration/type. * **70:** Dimensional/Fin code. * **C2:** Material/Thermal Interface (Aluminum + ATS-CPV2). * **R0:** Packaging/Revision code.