The **ATS-17D-71-C2-R0** is a high-performance electronic cooling component, specifically an **Aluminum Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for efficient thermal management on Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (H)** | 20.00 mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 1.15 °C/W (at 200 LFM) | | **Weight** | ~48.0 grams | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Fine Pitch" fin design maximizes the surface area, allowing for better heat dissipation in airflow-restricted environments. #### B. The PushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical fastening system consisting of: * **Brass/Plastic Pins:** Secure the sink to the PCB through pre-drilled holes. * **Stainless Steel Springs:** Provide "Precise Force Control," ensuring consistent pressure between the heat sink and the electronic component (like a CPU or FPGA) for optimal heat transfer. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **Phase Change Material (PCM)** or high-performance thermal grease (typically T766) on the base. This fills microscopic air gaps between the component and the heat sink. --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **17** | Series Number | | **D** | Attachment Type (pushPIN) | | **71** | Specific Model/Dimension ID | | **C2** | Thermal Performance/Fin Geometry | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Implementation Example To integrate this into a hardware design, the PCB layout must account for the specific hole pattern for the pushpins. ```yaml PCB_Layout_Requirements: Hole_Pattern: 38.00 mm x 38.00 mm (Center to Center) Hole_Diameter: 3.175 mm (approx. 1/8 inch) Keep_Out_Zone: 50.00 mm (to avoid component interference) ```