The **ATS-17D-72-C2-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** product line, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | | **Thermal Resistance (Flowing Air)** | 1.15 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 2.15 °C/W | | **Attachment Method** | pushPIN™ (Brass Pins / Plastic Pins) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Components The "electronic" functionality of this part is passive, meaning it does not require electricity to run but is critical for the thermal management of active electronics. ### A. The Heat Sink Body (maxiFLOW™) * **Geometry:** The fin design is spread out (tapered) to maximize surface area while maintaining a low pressure drop. This allows it to perform exceptionally well in systems with moderate to high airflow. * **Material Choice:** The aluminum construction offers high thermal conductivity while remaining lightweight, preventing mechanical stress on the PCB (Printed Circuit Board). ### B. pushPIN™ Attachment System This is the mounting mechanism that secures the heat sink to the electronic component. * **Pressure Management:** The system uses a specific spring rate to ensure even pressure across the processor's surface, which is vital for efficient heat transfer and preventing damage to delicate silicon dies. * **Reliability:** Unlike adhesive tapes, the pushPIN system is vibration-resistant and allows for easy removal and re-application during maintenance. ### C. Thermal Interface Material (T766) * The bottom of the heat sink comes pre-applied with **T766**. This is a thermal grease/paste that fills the microscopic air gaps between the heat sink and the chip, significantly lowering the thermal resistance of the junction. --- ## 3. Applications in Electronics The ATS-17D-72-C2-R0 is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling for MOSFET arrays or large voltage regulators. ---