The **ATS-17D-72-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series designed for high-performance cooling of integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Thermal Resistance** | 5.19 °C/W @ 100 LFM (Linear Feet per Minute) | | **Pressure Drop** | 0.15 in. H2O @ 100 LFM | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | --- ## 2. Key Electronic Components & Features ### A. Fin Design (Straight Fin) The "72" series typically utilizes a **straight-fin** geometry. This design is optimized for environments where there is a consistent, unidirectional airflow. The spacing between the aluminum fins allows for maximum surface area to dissipate heat away from the processor. ### B. Attachment Mechanism (Push Pins) Instead of using thermal adhesive, which can fail under high vibrations, this part uses a **mechanical push-pin system**: * **Pins:** Brass pins that snap into pre-drilled holes on the PCB. * **Springs:** Provide constant pressure (compression) between the heat sink and the electronic chip, ensuring a stable thermal interface. ### C. Thermal Interface Material (TIM) The "C3" designation in the part number indicates the type of thermal interface. This model comes with a **pre-applied phase-change material** or high-performance thermal pad. This eliminates the need for manual application of thermal paste and ensures air gaps are filled for better heat transfer. --- ## 3. Applications This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required. 3. **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. 4. **Processors:** Cooling for BGA (Ball Grid Array) chips and FPGAs. --- ## 4. Part Number Breakdown Understanding the code helps in identifying the exact variant: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **17:** Indicates the specific product family/series. * **D:** Specific mounting hole pattern or pin type. * **72:** Dimensions and Fin configuration code. * **C3:** Refers to the Thermal Interface Material (TIM) type. * **R0:** Revision code or RoHS compliance indicator.