The **ATS-17D-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling sensitive electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Springs/Plastic Pins) | | **Flow Pattern** | Cross-Cut (Omnidirectional) | | **Thermal Resistance (Unducted)** | 15.02 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Pitch (Hole-to-Hole)** | 30.00mm | --- ### 2. Physical Design Features * **Cross-Cut Fin Pattern:** The "Cross-Cut" design means the fins are not just parallel lines but are cut across. This allows for effective cooling regardless of the direction of the airflow (omnidirectional), making it ideal for enclosures with complex air currents. * **PushPIN™ Assembly:** This part uses a specialized mounting system. Instead of adhesives or screws, it uses spring-loaded pins that snap into the PCB. This ensures: * **Consistent Pressure:** Even contact with the chip for better heat transfer. * **Secure Fit:** Resistance to vibration and shock. * **30mm Height:** This is a relatively tall heat sink for a 25mm footprint, providing a larger surface area for heat dissipation in vertical spaces. --- ### 3. Electronic Application This part is typically used to protect the following types of electronic components: 1. **Microcontrollers & FPGAs:** Used in industrial or networking gear where chips generate significant heat. 2. **Power Converters:** To cool VRMs (Voltage Regulator Modules) on a motherboard. 3. **LED Drivers:** High-intensity LED systems that require passive cooling to prevent burnout. --- ### 4. Thermal Performance Data * **Low Airflow (1.0 m/s):** 15.02 °C/W * **High Airflow (3.5 m/s):** 4.02 °C/W * **Benefit:** The "C3" in the part number indicates a specific thermal performance rating and hardware configuration optimized for high-density boards.