The **ATS-17D-80-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** from the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its technical specifications and electronic application. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17D-80-C2-R0 | | **Thermal Resistance** | 1.90°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Pitch** | Fine Pitch (High-density fins) | --- ### 2. Key Component Features #### A. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this part uses the **pushPIN™** system. It consists of: * **Compression Springs:** Provide precise pressure to ensure optimal thermal contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Brass/Plastic Pins:** Secure the assembly through pre-drilled holes in the PCB. #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **T766** thermal phase-change material. This ensures low thermal resistance at the interface without the mess of manual thermal paste application. #### C. Fin Design It features a **cross-cut** or high-density fin pattern designed to maximize surface area. This is critical for electronic parts that generate significant heat in tight enclosures with limited airflow. --- ### 3. Application in Electronics This part is typically used to cool mid-range integrated circuits (ICs) that operate under high thermal loads. Common applications include: 1. **Telecommunications:** Cooling Network Processors and ASICs. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from high-current voltage regulators. 4. **Computing:** Cooling chipsets on motherboards or high-speed storage controllers. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 1.90 | 1.15 | 0.94 | 0.83 | ---