The **ATS-17D-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling solution to a Printed Circuit Board (PCB). --- ### Technical Specifications | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17D-82-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 30.0mm x 30.0mm x 25.0mm | | **Fin Type** | Straight Fin (Cross-cut) | | **Thermal Resistance** | 2.49°C/W @ 200 LFM | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Thermal Mass) The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just aesthetic; it provides surface protection and slightly increases emissivity to aid in radiant cooling. #### 2. Push-Pin Attachment Mechanism Instead of using adhesive tapes or clips, this part uses a mechanical push-pin system: * **Pins:** Usually made of plastic or brass. * **Springs:** Provides a specific amount of compression force (preload) to ensure constant contact between the heat sink and the electronic component (CPU/GPU/FPGA). #### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766** thermal interface material. This is a high-performance phase-change material pre-applied to the base of the heat sink. It fills microscopic air gaps between the component die and the heat sink to lower thermal resistance. --- ### Application Usage This specific heat sink is typically used for cooling: * **Processors (CPUs/GPUs):** Small form factor chips requiring active or passive airflow. * **ASICs and FPGAs:** High-heat density logic chips in networking equipment. * **Power Electronics:** High-voltage regulators that generate significant heat during operation. --- ### Performance under Airflow (LFM) | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.21 | | 200 (1.0 m/s) | 2.49 | | 400 (2.0 m/s) | 1.70 |