The **ATS-17D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 25mm | | **Flow Direction** | Vertical / Omni-directional (Straight Fin) | --- ### 2. Physical Design & Features The part belongs to the **pushPIN™** line, which is engineered for secure and easy mounting onto Printed Circuit Boards (PCBs). * **Straight Fin Design:** The "90" in the part number refers to the specific fin configuration. Straight fins provide consistent performance in environments where the airflow direction is known. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase change material. This ensures optimal heat transfer between the component surface and the heat sink base without requiring manual paste application. * **Compression Spring:** The push-pin mechanism includes a precisely engineered spring that provides the necessary pressure (force) to ensure a tight bond between the heat sink and the chip, improving thermal conductivity. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the "ATS-17D-90-C2-R0" code: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **17** | Series number (pushPIN family) | | **D** | Attachment type / Spring Force | | **90** | Specific Fin and Body geometry | | **C2** | Thermal Interface Material (T766) and Color (Blue) | | **R0** | Revision status | --- ### 4. Application Use Cases * **Embedded Systems:** Ideal for cooling compact processors on motherboards. * **Telecommunications:** Used in routers and switches where airflow is managed by chassis fans. * **Power Electronics:** Dissipating heat from high-speed ASICs or FPGAs.