The **ATS-17D-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) | | **Thermal Resistance** | 15.31 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine-Pitch (Straight Fin) | --- ### 2. Physical Design & Construction * **Base Material:** Made of high-grade aluminum to balance weight and thermal conductivity. * **Fin Profile:** The "98" series typically features a straight-fin design which allows for maximum surface area while maintaining a low profile (15mm height). * **Attachment Mechanism:** It uses the **pushPIN™** system, which consists of a flexible spring-loaded pin. This provides consistent pressure across the interface material, ensuring optimal heat transfer without over-stressing the PCB. --- ### 3. Thermal Performance Analysis The performance of this heat sink is highly dependent on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.31 | | 200 (1.0 m/s) | 5.81 | | 400 (2.0 m/s) | 3.20 | | 600 (3.0 m/s) | 2.49 | --- ### 4. Typical Applications This specific part is used in environments where space is limited but heat dissipation is critical: * **Telecommunications:** Cooling of networking processors. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling of VRMs (Voltage Regulator Modules) or MOSFET arrays. --- ### 5. Installation Note The **"R0"** suffix indicates that the product is RoHS (Restriction of Hazardous Substances) compliant, making it suitable for modern global manufacturing standards. It is usually paired with a **Thermal Interface Material (TIM)**, such as a pre-applied phase-change material or thermal grease, to fill microscopic air gaps between the chip and the heat sink base.