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  • ATS-17D-99-C2-R0

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    The **ATS-17D-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the core technical details: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Heat Sink Type** | pushPIN™ HS Assembly, Fine-Pitch, Straight | | **Thermal Resistance** | 11.51°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Mounting Hole Spacing** | 38.00mm x 38.00mm | --- ## 2. Key Component Features ### A. pushPIN™ Mounting System Unlike traditional adhesive or clip-based heat sinks, this part uses the **pushPIN™** system. * **Spring-loaded Mechanism:** Provides a precise and consistent pressure across the interface between the chip and the heat sink. * **Brass Components:** The pins are usually made of brass or plastic with a stainless steel spring for durability. ### B. Fin Geometry The "Fine-Pitch" design means the fins are spaced closely together. * **Surface Area:** This maximizes the surface area available for cooling. * **Airflow Requirements:** Fine-pitch heat sinks are generally more efficient in systems with forced airflow (fans) rather than passive cooling. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer. --- ## 3. Physical Dimensions (Mechanical Drawing) ```text Length: 45.00 mm (A) Width: 45.00 mm (B) Height: 20.00 mm (C) Pitch: 38.00 mm (E) / 38.00 mm (F) ``` --- ## 4. Performance vs. Airflow The efficiency of the ATS-17D-99-C2-R0 depends heavily on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): * **@ 100 LFM:** 11.51 °C/W * **@ 200 LFM:** 4.03 °C/W * **@ 500 LFM:** 1.83 °C/W *Note: Lower °C/W values represent better cooling performance.*
    ✨ Follow-up Questions
    • ⤷ What are the advantages of using pushPIN™ mounting over thermal adhesive?
    • ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance or durability?
    • ⤷ Can this heat sink be used for passive cooling without a fan?