ATS-17D-99-C2-R0
AI

The **ATS-17D-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here are the core technical details:
| Attribute | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Heat Sink Type** | pushPIN™ HS Assembly, Fine-Pitch, Straight |
| **Thermal Resistance** | 11.51°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Mounting Hole Spacing** | 38.00mm x 38.00mm |
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## 2. Key Component Features
### A. pushPIN™ Mounting System
Unlike traditional adhesive or clip-based heat sinks, this part uses the **pushPIN™** system.
* **Spring-loaded Mechanism:** Provides a precise and consistent pressure across the interface between the chip and the heat sink.
* **Brass Components:** The pins are usually made of brass or plastic with a stainless steel spring for durability.
### B. Fin Geometry
The "Fine-Pitch" design means the fins are spaced closely together.
* **Surface Area:** This maximizes the surface area available for cooling.
* **Airflow Requirements:** Fine-pitch heat sinks are generally more efficient in systems with forced airflow (fans) rather than passive cooling.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer.
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## 3. Physical Dimensions (Mechanical Drawing)
```text
Length: 45.00 mm (A)
Width: 45.00 mm (B)
Height: 20.00 mm (C)
Pitch: 38.00 mm (E) / 38.00 mm (F)
```
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## 4. Performance vs. Airflow
The efficiency of the ATS-17D-99-C2-R0 depends heavily on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM):
* **@ 100 LFM:** 11.51 °C/W
* **@ 200 LFM:** 4.03 °C/W
* **@ 500 LFM:** 1.83 °C/W
*Note: Lower °C/W values represent better cooling performance.*
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What are the advantages of using pushPIN™ mounting over thermal adhesive?
- ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance or durability?
- ⤷ Can this heat sink be used for passive cooling without a fan?