The **ATS-17E-07-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** Heat Sink Assembly series, designed for thermal management in electronic circuits. --- ### ## 1. Technical Specifications The part is primarily defined by its physical dimensions and thermal performance characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17E-07-C2-R0 | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 17.00°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Pitch** | Fine Pitch | --- ### ## 2. Core Electronic Functions While the device is not "active" electronics (like an IC), it is a critical "passive" component for electronic stability: 1. **Thermal Dissipation:** It increases the surface area for heat exchange, preventing semiconductor junctions from exceeding their maximum operating temperature. 2. **Spring-Loaded Attachment:** The "pushPIN" mechanism ensures consistent pressure across the thermal interface material (TIM), which minimizes thermal impedance between the chip and the sink. 3. **EMI Considerations:** Because it is an aluminum structure, it can occasionally influence the electromagnetic profile of the board, requiring proper grounding or layout consideration. --- ### ## 3. Breakdown of the Part Number The alphanumeric code provides specific details about the configuration: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **17:** Specific series or designator. * **E:** Indicates the attachment method (in this case, pushPIN). * **07:** Size/Shape designator. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### ## 4. Application Context This component is typically found in: * **Networking Hardware:** Routers and switches with high-speed processors. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where airflow might be restricted.