The **ATS-17E-101-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the core electronic and physical characteristics: | Property | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The alphanumeric string provides specific details about the part's construction: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17E**: Series and specific geometric pattern. * **101**: Size/Dimension code. * **C2**: Refers to the **Aluminum** material with a **Blue Anodized** finish. * **R0**: Version/Revision number. --- ### 3. Key Electronic Components & Features While the heat sink itself is passive, its design interacts with electronic systems in the following ways: #### A. Thermal Interface Material (TIM) The base of this heat sink is pre-applied with **T766**. This is a phase-change material that fills microscopic air gaps between the electronic component (die) and the heat sink, ensuring maximum heat transfer efficiency. #### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the `pushPIN™` system uses a flexible, spring-loaded mechanism. This is critical for electronic stability because: * It provides **precise pressure**, preventing damage to delicate silicon dies. * It allows for **thermal expansion** and contraction without stressing the PCB. #### C. Fin Design The heat sink features a **straight-fin** or **cross-cut** design (depending on the specific airflow requirement) optimized for forced air cooling. This is essential for maintaining the "Safe Operating Area" (SOA) of power transistors and high-speed processors. --- ### 4. Typical Applications * **BGA Cooling:** Used for Field Programmable Gate Arrays (FPGAs) and ASICs. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Embedded Systems:** Industrial PCs where high-vibration resistance is needed (provided by the pushPIN attachment).