The **ATS-17E-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-17E-182-C2-R0 | | **Heat Sink Type** | Top Mount (Push-Pin) | | **Material** | Aluminum | | **Fin Style** | Straight | | **Thermal Resistance** | 7.51°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Dimensions Precise physical measurements are critical for PCB layout and clearance. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 15.00 mm * **Push-Pin Spacing:** 45.00 mm --- ### 3. Key Electronic/Mechanical Features * **Push-Pin Attachment:** The "17E" designation refers to the specific attachment mechanism. It uses a flexible, spring-loaded push-pin that snaps into pre-drilled holes on a PCB, providing constant pressure on the component for optimal heat transfer. * **T766 Interface Material:** This model comes with a pre-applied Phase Change Material (PCM). This eliminates the need for manual thermal paste application and ensures uniform coverage between the heat sink and the chip. * **Blue Anodized Finish:** The "R0" at the end typically denotes the finish and compliance standards (RoHS). The blue anodization increases the surface emissivity and protects the aluminum from corrosion. * **Flow Design:** The straight-fin design is optimized for environments with high airflow (LFM - Linear Feet per Minute), allowing air to pass through the fins and carry heat away from the source. --- ### 4. Typical Applications This component is generally used in: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).