## Electronic Component Overview: ATS-17E-72-C2-R0 The **ATS-17E-72-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is critical in electronics for thermal management of semiconductors, processors, and power modules. --- ### 1. Technical Specifications The following table highlights the key physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Off Base)** | 25.00 mm | | **Attachment Method** | Push-pin (Plastic/Brass) | | **Thermal Resistance** | 5.11°C/W (Unducted Flow @ 1.0 m/s) | --- ### 2. Design Features * **Fin Design:** It utilizes a **Cross-Cut** pattern, which allows for better airflow across the heat sink from multiple directions, making it more efficient in systems with unpredictable air currents. * **Attachment Mechanism:** The `R0` designation refers to the specific push-pin and spring kit. This ensures the correct pressure (load) is applied to the electronic component for optimal heat transfer. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance thermal grease (often T412) to reduce air gaps between the component and the heat sink. --- ### 3. Part Number Breakdown The part number follows the standard ATS pushPIN™ nomenclature: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **17** | Series | pushPIN™ Heat Sink Series | | **E** | Attachment | E-type (Specific spring/pin configuration) | | **72** | Dimensions | Reference code for 45mm x 45mm footprint | | **C2** | Thermal Performance | Specific fin density and material grade | | **R0** | Finish/Kit | Blue Anodized finish with standard mounting kit | --- ### 4. Typical Applications This component is used to cool high-heat electronic devices including: 1. **CPUs and GPUs** in embedded systems. 2. **ASICs and FPGAs** used in networking hardware. 3. **Power MOSFETs** or IGBTs in power conversion modules. 4. **LED Drivers** requiring compact thermal dissipation. ---