The **ATS-17E-75-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors. It is manufactured by Advanced Thermal Solutions (ATS). --- ## Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 15.29°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T412 (Phase Change) | --- ## Key Features ### 1. pushPIN™ Attachment System The "75" in the part number refers to the specific attachment mechanism. This system uses a spring-loaded push-pin to provide a secure, consistent pressure on the heat source, ensuring optimal thermal contact without the need for messy adhesives or permanent soldering. ### 2. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, which is a high-performance phase-change material. When the component heats up, the material softens to fill microscopic gaps between the heat sink and the chip, significantly lowering thermal resistance. ### 3. Fin Design The heat sink utilizes a **cross-cut** or **pin-fin** geometry. This allows for multi-directional airflow, making it highly effective in compact electronic enclosures where air may not flow in a straight line. ### 4. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized:** The coating is not just for aesthetics; it protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ## Applications This specific small-form-factor heat sink (25mm x 25mm) is typically used for: * **Networking Equipment:** Cooling chipsets in routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or MOSFETs.