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  • ATS-17F-01-C3-R0

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    The **ATS-17F-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Type** | Board Level Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | XCUT (Straight Fins with cross-cuts) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.90°C/W (Natural Convection) | | **Thermal Interface Material** | T412 (Double-sided adhesive/tape) | --- ### 2. Key Design Features #### A. XCUT Fin Pattern The "XCUT" design features vertical fins that have been cut horizontally. This creates a matrix of pins/blocks which: * Increases the surface area for heat dissipation. * Allows for **multi-directional airflow**, meaning the cooling efficiency is less dependent on the direction the fan is blowing. #### B. Push-Pin Attachment The `-R0` suffix indicates the specific mounting hardware. This model uses a **push-pin and compression spring** mechanism. * **Benefits:** Provides consistent pressure for optimal thermal contact and allows for easy installation into pre-drilled holes on the PCB. * **Reliability:** More secure than adhesive-only methods in high-vibration environments. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, which is a high-performance thermal tape. This ensures there are no microscopic air gaps between the heat source (chip) and the aluminum base of the heat sink. --- ### 3. Application Use Cases This specific heat sink is commonly found in: * **Networking Hardware:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **17:** Series identifier * **F:** Fin height/style code * **01:** Specific dimensions within the series * **C3:** Blue Anodized finish * **R0:** Revision/Mounting hardware specific code
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at 200 LFM airflow?
    • ⤷ Can the T412 interface material be replaced with thermal paste?
    • ⤷ What is the recommended PCB hole diameter for the push-pin mounting?