The **ATS-17F-04-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 11.58°C/W (at 200 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Fin Pattern** | XCUT (Cross-Cut) | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body (Aluminum) The body is made of **AL6063 aluminum**, chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. #### B. The XCUT Fin Design Unlike straight-fin heat sinks, the **XCUT** (cross-cut) design provides a "pin-fin" effect. - **High Airflow Efficiency:** It allows for multidirectional airflow, which is critical in dense electronic enclosures where air may not move in a perfectly straight line. - **Surface Area:** The cuts increase the total surface area available for convection. #### C. Push-Pin Attachment System The "R0" designation usually refers to the specific attachment kit included. - **Brass Push-Pins:** These provide a secure mechanical connection to the PCB. - **Compression Springs:** These ensure a consistent, pre-determined "clamping force" (pressure) between the heat sink and the electronic chip. This is vital to minimize the thermal interface gap. --- ### 3. Thermal Performance Profile Thermal resistance determines how effectively the part moves heat away from the silicon die. Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 11.58 | | **400 (2.0 m/s)** | 6.36 | | **600 (3.0 m/s)** | 4.33 | --- ### 4. Typical Applications * **Networking Equipment:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.