The **ATS-17F-07-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed for surface-mount electronics such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 16.97 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45.00mm x 45.00mm x 12.70mm | | **Mounting Hole Pattern** | 38.00mm x 38.00mm | | **Spring Type** | ATS-PPS-17 (Stainless Steel) | --- ### 2. Electronic Application & Performance Heat sinks like the ATS-17F-07-C2-R0 are critical for the longevity of electronic parts. This specific model uses a **fine-pitch design** to maximize surface area within a low-profile height (12.70mm). * **Thermal Management:** The "C2" in the part number indicates a specific thermal performance rating. It is designed to dissipate heat away from the semiconductor die into the ambient air. * **Airflow Efficiency:** The fin geometry is optimized for "ducted" or "unducted" airflow, meaning it works effectively even in systems with low-speed cooling fans. * **Mechanical Stability:** The use of a push-pin and spring mechanism provides a consistent "pressure" (preload) against the electronic chip, ensuring an even layer of Thermal Interface Material (TIM) for better conduction. --- ### 3. Component Breakdown (Nomenclature) The part number follows the standard ATS naming convention: 1. **ATS:** Manufacturer (Advanced Thermal Solutions). 2. **17:** Series or specific geometry type. 3. **F:** Fin pitch/style (likely Fine pitch). 4. **07:** Specific dimension/height code. 5. **C2:** Thermal performance grade and material/finish indicator. 6. **R0:** Revision code or RoHS compliance indicator. --- ### 4. Installation Requirements To use this part on a PCB, the board must have: * Two pre-drilled holes spaced **38mm** apart. * A compatible **Thermal Interface Material (TIM)** applied between the component and the heat sink base.