The **ATS-17F-07-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 17.09 °C/W @ 100 LFM | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 12.70 mm | | **Pitch** | Fine Pitch | | **Pattern** | XCUT | --- ### 2. Breakdown of the Part Number The part number can be decoded to understand its configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17**: Series number. * **F**: Fin pitch/type (Fine). * **07**: Specific geometry/size code. * **C3**: Thermal Interface Material (TIM) and finish code (typically indicates T412 or similar high-performance TIM). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Performance The heatsink is designed for "XCUT" airflow, meaning it is optimized to dissipate heat efficiently across the surface area even in low-airflow environments. The **Fine Pitch** fin design maximizes the surface area for heat exchange. #### B. The pushPIN™ Attachment System Unlike adhesive tapes, this part uses a **pushPIN™** system which includes: * A brass or plastic pin. * A stainless steel compression spring. * **Benefit:** Provides consistent pressure (clamping force) on the electronic component, ensuring better contact with the Thermal Interface Material (TIM) and preventing the heatsink from shifting due to vibration. #### C. Thermal Interface Material (TIM) The "C3" designation usually indicates that the heatsink comes with a **Pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that minimizes air gaps between the heat source and the aluminum base. --- ### 4. Applications * **Embedded Systems:** Cooling processors in tight enclosures. * **Telecommunications:** Used on high-speed data processing chips. * **Power Supplies:** Dissipating heat from power transistors or MOSFETs.