The **ATS-17F-08-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series, designed for cooling electronic components such as CPUs, GPUs, or high-power chipsets. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 15.00mm | | **Thermal Resistance** | 14.71°C/W (at 100 LFM) | | **Fin Style** | XCUT (Cross-cut) | --- ## 2. Component Analysis ### A. Material and Finish The heat sink is made from **Aluminum**, which provides a good balance between thermal conductivity and weight. The **Blue Anodized** finish is not just for aesthetics; it provides a thin protective layer that increases corrosion resistance and slightly improves surface emissivity for better radiation heat transfer. ### B. XCUT (Cross-cut) Fin Design Unlike straight-fin heat sinks, the XCUT design features fins that are cut both horizontally and vertically. This creates a "pin" or "grid" effect which: * Allows for **multidirectional airflow**, meaning the cooling efficiency is less dependent on the direction the fan is blowing. * Increases the surface area for heat dissipation without significantly increasing the footprint. ### C. Attachment Mechanism (Push-Pin) The "R0" at the end of the part number typically signifies the specific mounting hardware. The push-pin system includes: * A pre-drilled hole pattern on the PCB. * A spring-loaded pin that provides **consistent pressure** across the thermal interface material (TIM). * Ease of installation compared to screw-mount or adhesive-tape solutions. --- ## 3. Part Number Breakdown The nomenclature for ATS heat sinks usually follows this logic: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17**: Series/Category. * **F**: Material/Fin orientation. * **08**: Specific dimensions or height code. * **C3**: Thermal Interface Material (TIM) type/attachment option. * **R0**: Versioning or packaging code. --- ## 4. Typical Applications This specific heat sink is used in environments where electronic components generate moderate heat and require a reliable, mechanically secured cooling solution: 1. **Networking Hardware**: Switches, routers, and modems. 2. **Embedded Systems**: Industrial PCs and IoT gateways. 3. **Power Electronics**: Voltage regulators and power modules.